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Endless Diamond Wire Loop Saw Silicon Cutting MachineEndless Diamond Wire Loop Saw Silicon Cutting MachineEndless Diamond Wire Loop Saw Silicon Cutting Machine
Endless Diamond Wire Loop Saw Silicon Cutting MachineEndless Diamond Wire Loop Saw Silicon Cutting MachineEndless Diamond Wire Loop Saw Silicon Cutting Machine

Endless Diamond Wire Loop Saw Silicon Cutting Machine

This silicon ingot cutting wire saw utilizes a cutting tool known as a circular diamond wire loop. It is a closed-loop diamond wire that can move in a single direction without the need for reversing. The circular diamond wire enables high linear speeds, reaching even up to 60 m/s. As a result, it allows for fast cutting speeds during silicon rod cutting, while maintaining superior cutting surface quality.

 

 

Product Features

Diamond wire saw machine is made to do silicon cut off/cropping, it uses diamond wire loop/endless diamond wire loop as cutting blade,far more small than diamond band saw.And there has less possibility of silicon edge break which decreases defective product rate.

1,Vertical cutting method.

2,The surface is waterproof which can do wet cut.

3,The tensioning system adopts adaptive tensioning system, there is no need to make tension force calculation.

Application of Endless Diamond Wire Loop Saw Cutting Machine

Materials diamond wire loop cut: Sapphire, Glass, Artificial crysal, Silicon, Magnetics, New material, Gem-stone, Ultrathin marble, Granite, Foamed aluminium, Rock wool, Foam cement, Ceramic, Graphite, Tire, Hollow brick, Corrugated paper, etc.

1, For the cutting of precious materials such as emerald, crystal, malachite, meteorite. The cutting kerf is small and the cutting speed is fast.It is suitable for the processing of various bracelets,pendants and annular section.

2, NdFeB, ferrite, samarium cobalt, alnico and other metal and non-metallic magnetic materials processing, the equipment has high safety, simple operation, large single cutting volume, whoes effiency is several times that of ID saw.

3, The cutting speed of crystal materials such as optical glass is fast, and the cutting surface is smooth and flat, replacing grinding with cutting.

4, Universities,enterprises,research institutes that need to cut a large number of new materials. This is a small equipment with fast cutting speed, high cutting precision and low material loss.

In addition, our cutting equipment can also be used for cutting various metal and non-metallic composite materials, glass, rock, jade, monocrystalline silicon, silicon carbide, ceramics Epoxy board and other materials, especially suitable for cutting high priced and easily broken high hard brittle materials!lf you have material cutting needs, you can contact us!

Endless Diamond Wire Loop Parameter

Diamond Wire Loop Parameters

Outer Diameter

(mm)

Core Wire

(mm)

Grain Size

EN

Tensile Strength

(N)

Recommend Loop Length

(mm)

Max Loop Length

(mm)

Cooling

0.3

0.24

D25

60-80

1000-3000

30000

Dry/Wet

0.35

0.24

D46

60-80

1000-3000

0.45

0.3

D46

80-100

1000-6000

0.5

0.36

D76

100-120

1000-6000

0.6

0.39

D107

100-120

1000-6000

0.8

0.51

D126

180-200

1000-6000

1.8

1.2

D213

200-300

2500-1000

2.5

2

D213

300-400

2500-10000

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Xrido is a manufacturing enterprise dedicated to the manufacture and sale machinery in the environmental protection industry.

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